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Food additive sodium tripolyphosphate(STPP)
Food additive sodium hexametaphosphate(SHMP)
Food additive Sodium pyrophosphate(TSPP) anhydrous
Food additive Sodium Acid Pyrophosphate(SAPP)
Food additive Tetrapotassium Pyrophosphate(TKPP)
Food additive Monopotassium Phosphate(MKP)
Food additive Tripotassium Phosphate(TKP)
Food additive trisodium phosphate
Food additive sodium hydrogen phosphate
Electronic grade sodium dihydrogen phosphate/Mono Sodium Phosphate
n-Hexane (Chromatographic grade)
Trichloromethane (Chromatographic grade)
Toluene (Chromatographic grade)
n-Hexane (for residue analysis)
Trichloromethane (for residue analysis)
Electronic grade Ammonium Sulfate
Electronic grade Phosphoric acid
English name: Copper pyrophosphate Item
IndexRequirements
Copper (Cu) content,% ≥
34
Chloride (Cl),% ≤
0.01
Sodium (Na),% ≤
0.5
Lead (Pb),% ≤
0.003
Iron (Fe),% ≤
0.01
Zinc (Zn),% ≤
0.005
Arsenic (As),% ≤
0.0005
Potassium diphosphate insoluble matter,% ≤
0.1
Molecular formula: Cu2P2O7
Property: Light blue or sky blue powder, insoluble in water, soluble in potassium diphosphate aqueous solution.
Packing instruction: PP-PE bags or paper bags.The net weight is 25kg/bag, or according to the customers' requirements.
Executive standard: Q/CDH 182-2012
Quality standard:
Usage: Mainly used in non-cyanide plating, printed circuit plastic plating and electroforming, in the copper under layer of decorative protective layer, etc
